Global Power Module Packaging Market Research: Insights for International Revenue Expansion

 The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.

The report also gives an insight into product portfolios, costs, sales, production capacities, and market players. Raw materials, demand analysis, product flow, and distribution channels have been studied and surveyed extensively in this research report. The key growth trends and opportunities are offered through a thorough investigation and examination of the market. A detailed course of development is offered in the report along with insights into businesses connected with it, which include firms, industries, organizations, vendors, and local manufacturers.

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Competitive Terrain:

The section on the competitive landscape offers valuable and actionable insights related to the business sphere of the Power Module Packaging market, covering extensive profiling of the key market players. The report offers information about market share, product portfolio, pricing analysis, and strategic alliances such as mergers and acquisitions, joint ventures, collaborations, partnerships, product launches and brand promotions, among others. The report also discusses the initiatives taken by the key companies to combat the impact of the COVID-19 pandemic.

The leading market contenders listed in the report are:

SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

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Emergen Research has segmented the global Power Module Packaging market on the basis of type, application, end-use, and region:

  • Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

    • Silicon Carbide (SiC) Module
    • Gallium Nitride (GaN) Module
    • Insulated-Gate Bipolar Transistor (IGBT) Module
    • Field-Effect Transistor (FET) Module
    • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    • Others

  • Technology Outlook (Revenue, USD Billion; 2019-2032)

    • Standard Packaging
    • Advanced Packaging
    • Pressure-Contact Modules
    • Others

  • Thermal type Outlook (Revenue, USD Billion; 2019-2032)

    • Liquid-Cooled
    • Air-Cooled
    • Hybrid

The various regions analyzed in the report include:

  • North America (U.S., Canada)
  • Europe (U.K., Italy, Germany, France, Rest of EU)
  • Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
  • Latin America (Chile, Brazil, Argentina, Rest of Latin America)
  • Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)

Key Objectives of the Report:

  • Analysis and estimation of the Power Module Packaging Market size and share for the projected period of 2022-2030
  • Extensive analysis of the key players of the market by SWOT analysis and Porter’s Five Forces analysis to impart a clear understanding of the competitive landscape
  • Study of current and emerging trends, restraints, drivers, opportunities, challenges, growth prospects, and risks of the global Power Module Packaging Market
  • Analysis of the growth prospects for the stakeholders and investors through the study of the promising segments
  • Strategic recommendations to the established players and new entrants to capitalize on the emerging growth opportunities

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